Power Optimization and Synthesis at Behavioral and System

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Language: English

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Metal Can Packages - Some chips, particularly op amps, are still packaged in metal can enclosures to minimize noise. This inherently limits the size of such substrates for integrated photonics and also requires sophisticated transfer techniques to prepare diamond-on-insulator 22 substrates, conceptually similar to silicon-on-insulator. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch.

Pages: 167

Publisher: Springer; 1999 edition (June 30, 1999)

ISBN: 0792385608

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